【Media Coverage】The article about COOL Chips 23 was published in EE Times Japan, Electronics Weekly.com and other many media.

【Media Coverage】The article about COOL Chips 23 was published in EE Times Japan, Electronics Weekly.com and other many media. 

 

<EE Times Japan>

LeapMindの極小量子化技術、ASICで性能見積もり

https://eetimes.jp/ee/articles/2004/20/news044.html

<Electronics Weekly.com>

LeapMind shows AI inference accelerator performance

https://www.electronicsweekly.com/news/business/732801-2020-04/

<工商時報>

LeapMind攜手世芯電子 宣佈超低精度量化神經網絡加速器IP性能

https://admin.ctee.com.tw/industrynews/technology/253892.html

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